eucleveladhesives
Validación Pendiente

Fecha de nacimiento

febrero 07, 1994 (30)

Acerca de eucleveladhesives

Biografía:

This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications. https://www.epoxyadhesiveglue.com/product/epoxy-underfill-chip-level-adhesives/

Localización:

Huizhou City, Guangdong，China

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